Epoxy potting/encapsulating/coating/casting/sealant compounds
Fong Yong ’s RTV / Heating epoxy potting / encapsulating resin / compound be used widely in Electrical and Electronic Industry -> electronic / electrical potting and encapsulating coating –> epoxy compound, insulating materialss, encapsulating coatings, casting, threat sealant, high temperature sealants, industrial sealants, filling, insulating materials, thermal insulation, impregnating for most electronic components and electronic applications and insulation materials.
Hard type of two compound epoxy mold for resin pouring, encapsulating in clear/color resin
- Flexible type of two compound epoxy mold for resin pouring, encapsulating in clear/color resin
- diod led series of two compound epoxy mold for resin pouring, encapsulating in clear/color resin
- UL 94V0 series - epoxy formulated compound
- one compound - epoxy formulated compound
diod led series of two compound epoxy mold for resin pouring, encapsulating in clear/color resin
UL 94V0 series - epoxy, silicone formulated compound
Doming resins│doming chemical│Clear doming resins │Epoxy doming resins│
│Polyurethane doming resins│ PU doming resins│ Domed coating │
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Hard type of two parts epoxy mold for encapsulating potting compounds in clear/color resin
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E-128B/H-128
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BLACK
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3:1
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5000/60
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Good weather resistance, high tensile strngth, very suitable for electrical & electronic insulating, potting & encapsulating
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E-190B/H-190
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Black
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100:40
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4400/100
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good electrical properties, low reactive energy, suitable for large electronic parts potting
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E-226/H-120
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Red
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100:40-50
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Paste/1200
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easy handle, nan-sag, suitable for large electronic components adhesive impregnating
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E-890A/H-105
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clear
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2:1
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2400/1500
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good weather resistance, high gloss surface, suitable for electronic components casting or film coating
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E-590B-1/H-590
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Black
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100:20
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25000/110
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good weather resistance and thmeral conductivty, suitable for electronic components insulating potting and encapsulating
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E-759BH/H-759H
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Black
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100:30
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75000/9500
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good weather resistance, longer pot-life, good thermal conductivty, suitable for electronic parts potting, encapsulating, casting and sealant
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E-5260B/H-5260
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Black
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100:80
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600/100
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high tensile strength, low viscosity, suitable for insulating, potting, encapsulating, cating
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E-5600B/H-5600
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Black
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2:1
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3000/600
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good electrical properties, easy handle, high temperature resistance, suitable for electrical & electronic insulating, potting, encapsulating and casting
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E-120/H-100
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colors
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3:1
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2100/30
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easy handle, low viscosity, general used.
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E-769B/H-769
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Black
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4:1
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paste/1200
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higher viscosity, suitable for capacitor coating, water proof, insulating, film protect, COB coating
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E-1009/H-1009
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colors
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3:1
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paste/100
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midle viscosity, high temperature resistance, high thermal conductivity, hating curing type, suitable for large electronic components casting
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E-638/H-638
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colors
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100:28
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paste/110
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higher viscosity, high voltage resistance, high thermal conductivity, suitable for high volt ignition for motor-vehicles
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E-566B/H-566
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Black
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3:1
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4500/600
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midle high voltage resistance, high thermal conductivity, l ow temperature resistance, suitable for high volt ignition for vehicles
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E-311W/H-311
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White
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2:1
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15000/12000
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thermal compound, thermal conductivity : 0.4W/mk
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│Potting compounds│epoxy potting compounds│Silicone potting compounds│Electronic potting and encapsulating compounds│Electrical and encapsulant potting compounds│
Flexible of two parts epoxy mold for potting encapsulating compound in clear / color resin
| E-185B/H-185B |
BLACK
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3:1
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1050/40
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easy handle, low viscosity, low elastic, suitable for delicate electrical and electronic components potting and encapsulating
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E-721B/H-721
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Black
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1:1
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900/200
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high tensile strength, elastic, low viscosity, low stress, suitable for delicate electrical components potting, encapsulating and casting
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| E-768/H-768 |
Black/Blue
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100:60
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2800/100
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good weather resistance, low temperature resistance, elastic, RTV cured, excellent electrical properties, suitable for electronic parts potting and encapsulating
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E-7311B/H-7311
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Black/Clear
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100:30
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4000/100
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easy handle, good impact strength and low temperature resistance suitable for electrical & electronic insulating, potting, encapsulating
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| E-X2/H-X2 |
colors
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2:1
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6000/120
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super flexible, good low temperature resistance and impact strength
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E-806B/H-806
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Black
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100:25
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20000/300
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flexible type, suitable for delicate electrical components insulating, potting, encapsulating and casting, low temperature more than -30 degree C
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Silicone thermal heatsink compounds,thermal│ comounds│Silicone thermal grease│Heatsink grease │Heat transfer conductive │
one compound - epoxy formulated compound
| E-1200 |
BLACK
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4000
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good fluidity, low temperature curable
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for small area potting of electric products
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E-1385B
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Red thixtropic
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150000
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fast cure short term high temperature resistance (280 oC)
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SMT adhesive, screen printing
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| EP-A |
BLACK
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40000-50000
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curing for low temperature good adhesive
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IC sealing or electronic components adhesives
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EP-A-2
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Black/Clear
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70000
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curing for low temperature good adhesives
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IC sealing or electronic components adhesives
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| EP-10-C |
Black
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80000
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curing for medial temperature, good adhesives
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IC sealing or electronic components adhesives
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home
cpu heat sink / thmeral compound
epoxy potting encapsulating compounds, insulating materials, sealants, coating
UL94V0 potting compound, insulating materials, sealants, coating
silicone potting/sealant/coating compounds
doming resin - polyurethane (urethane, PU), epoxy
FONG YONG Chemical Co., Ltd.
2F. No 216-2, Chung Chang Rd, Su-Lin, Taipei Hsien, Taiwan, R.O.C.
TEL : 886-2-2682-4939 FAX : 886-2-2683-4333
E-Mail : fongyong@ms23.hinet.net
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